IM156-3bus

n Dimension :156 mm x 156 mm ± 0.5 mm
nn Thickness ( Si ) : 260 µm ± 35 µm
n Front: silicon nitride antireflection coatings,1.5 mm silver busbar
n Back: full - surface aluminum back-surface field ,4.5 mm ( silver / aluminum ) continuous soldering pads

IM156-2bus

n Dimension :156 mm x 156 mm ± 0.5 mm
n Thickness ( Si ) :260 µm ± 35 µm
n Front: silicon nitride antireflection coatings,1.8 mm silver busbar
n Back: full - surface aluminum back-surface field ,4.5 mm ( silver / aluminum ) continuous soldering pads

M156

n Dimension :156 mm x 156 mm ± 0.5 mm
nn Thickness ( Si ) : 260 µm ± 35 µm
n Front: blue silicon nitride antireflection coatings,1.8mm silver busbar
n Back: full - surface aluminum back-surface field ,4.5 mm ( silver / aluminum ) continuous soldering pads