R156

Dimension : 156 mm x 156 mm ± 0.5 mm
Diagonal : 200 mm ± 1.0 mm
Thickness ( Si ) : 550 µm ± 50 µm
Front : blue silicon nitride antireflection coatings
1.8 mm silver busbar
Back : full - surface aluminum back-surface field ,
4.5 mm ( silver / aluminum ) continuous soldering pads

IS156 - R206

Dimension :156 mm x 156 mm ± 0.5 mm
Diagonal:206mm ± 1.0 mm (round chamfers)
Thickness ( Si ) :260µm±35µm
Front:silicon nitride antireflection coatings,1.8 mm silver busbar
Back: full - surface aluminum back-surface field ,4.5 mm ( silver / aluminum ) continuous soldering pads

IS156-R202

Dimension :156 mm x 156 mm ± 0.5 mm
Diagonal:202mm(round chamfers)
Thickness ( Si ) :260µm±35µm
Front:silicon nitride antireflection coatings,1.8 mm silver busbar
Back: full - surface aluminum back-surface field ,4.5 mm ( silver / aluminum ) continuous soldering pads